G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title and employees must be trained

and employees must be trained

This Standard is applicable to backlight units

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 24

しかし，本標準はテストウェーハ，プレミアムウェーハ，リクレームウェーハおよびエピ，アニール，SOIウェーハ用の鏡面研磨基版およびウェーハの発注に役立つ情報を提供する。

このスタンダードはコンセプトおよび挙動からメッセージサービスまでの解決策を提示している。メッセージ送受信プロトコルは定義していない。

G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title and employees must be trainedThis specification defines the standard requirements for co fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e. g., high speed, digital VLSI silicon devices), and next level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques. Referenced