S00600 - SEMI S6 - 半導體製造設備排氣通風基準 Revision:SEMI S6-0618 - Current キネマティックカプリングピンと結合し15 mmのリードイン（自動求心）を確保する機構（オプション） (3)

キネマティックカプリングピンと結合し15 mmのリードイン（自動求心）を確保する機構（オプション）　 (3)

This guide document provides additional information about the Equipment Data Acquisition (EDA) SEMI Standards suite

or implantation onto or below the surface of a circular silicon wafer having the opposite conductivity type from the thin layer to be measured or by the deposition of polysilicon over an insulating layer

SEMI F75-1102 (Reapproved 0309)

This Practice describes measurement site patterns and determination of their spatial coordinates on the wafer

S00600 - SEMI S6 - 半導體製造設備排氣通風基準 Revision:SEMI S6-0618 - Current キネマティックカプリングピンと結合し15 mmのリードイン（自動求心）を確保する機構（オプション） (3)NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. Semiconductor Manufacturing EquipmentSME REF _Ref515551479 \h \r \t \* MERGEFORMAT 8 08D0C9EA79F9BACE118C8200AA004BA90B02000000080000000E0000005F005200650066003500310035003500350031003400370039000000 Referenced SEMI StandardsSEMI F5 Guide for