S00900 - SEMI S9 - Guide to Electrical Design Verification Tests for Semiconductor Manufacturing Equipment that have Been Moved to SEMI S22 Revision:SEMI S9-0307 (Withdrawn 0211) - Withdrawn SEMI MF1049 — Practice for

SEMI MF1049 — Practice for Shallow Etch Pit Detection on Silicon Wafers

previously published in 1995

org in November 2014

CMP criteria can be determined by metrology technology in both contact methods such as: micro profilometer

静電気電荷起因の装置動作における問題や付随的に発生する製品欠陥は，半導体製造装置の所有コスト（COO： cost of ownership）へのマイナス要因となるかもしれない（SEMI E35を参照）｡

S00900 - SEMI S9 - Guide to Electrical Design Verification Tests for Semiconductor Manufacturing Equipment that have Been Moved to SEMI S22 Revision:SEMI S9-0307 (Withdrawn 0211) - Withdrawn SEMI MF1049 — Practice forThe purpose of this document is to provide a permanent withdrawal notice for SEMI S9 indicating that all technical content has been incorporated within SEMI S22. Referenced SEMI Standards SEMI S1 Safety Guideline for Equipment Safety Labels SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment SEMI S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment