G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 SEMI M64 — Test Method

SEMI M64 — Test Method for the El2 Deep Donor Concentration in Semi-Insulating (SI) Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy

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and materials use measurement and conversion of use measurements into equivalent energy

2  The dislocation etch pit density is used as a measure for the dislocation density or the crystallographic perfection of a crystal

SEMI E90 — Specification for Substrate Tracking

G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip StdPbc-0220 SEMI M64 — Test MethodThis Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1994. NOTICE: This Document was reapproved with minor editorial changes. This Guideline details recommendations for a standardized thermal test chip design for