Computer Backplate AP660 The automatic solder paste application
$218.75
Description
The automatic solder paste application system streamlines production by automatically refilling solder paste
01 mm precision
high-resolution imaging
it quickly heats up using high-speed PID to control temperature output
temperature
Computer Backplate AP660 The automatic solder paste applicationComputer Backplate
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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