Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues Ingestion-build-201039 access and transfer of personally

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Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues Ingestion-build-201039 access and transfer of personallyBS EN ISO 9455 17: 2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, in solid or liquid form, or in the form of flux cored solder wire, solder preforms or solder paste constituted with eutectic or near eutectic tin lead (Sn Pb) solders (ISO 9453: 1990, Class E). This test method is also applicable to fluxes for use