Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 • Hydrogen-embrittlement-relief heat treatments

• Hydrogen-embrittlement-relief heat treatments

They may be used at temperatures up to 200 °C maximum on nickel plated conductors with insulation rated for at least 135 °C

Establishing a procurement system

Delivery documents

IEC 60034 (all parts)

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 • Hydrogen-embrittlement-relief heat treatmentsDD IEC PAS 62137 3: 2009 describes the selection of an appropriate test method for reliability testing of solder joints. The test methods given are applicable to evaluate the strength of joints of a component mounted on printed wiring board, but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range