coated Si Wafer (4 inch size) Thickness of highly oriented polycrystalline Cu <111> film: 400 nm Thickness of Ta diffusion barrier: 50 nm 4 inch dia x0. 525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk P type, B doped, <100> orientation, SSP Resistivities: 1 20 ohm cm Surface Roughness: as grown , N A Package: One 1000 class clean room with 100 class plastic bag"> coated Si Wafer (4 inch size) Thickness of highly oriented polycrystalline Cu <111> film: 400 nm Thickness of Ta diffusion barrier: 50 nm 4 inch dia x0. 525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk P type, B doped, <100> orientation, SSP Resistivities: 1 20 ohm cm Surface Roughness: as grown , N A Package: One 1000 class clean room with 100 class plastic bag"> coated Si Wafer (4 inch size) Thickness of highly oriented polycrystalline Cu <111> film: 400 nm Thickness of Ta diffusion barrier: 50 nm 4 inch dia x0. 525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk P type, B doped, <100> orientation, SSP Resistivities: 1 20 ohm cm Surface Roughness: as grown , N A Package: One 1000 class clean room with 100 class plastic bag"> Cu Film on Ta/SiO2/ 4"Silicon Wafer, Cu=400 nm Ta=50nm SiO2=300nm, Si(100) P-type B-doped 4"x0.525mm, 1sp High Purity Chemical A-Z The slot die heads are – allanportilho.com

New Arrivals are Here-Fast Shipping from Our USA Warehouse

Cu Film on Ta/SiO2/ 4"Silicon Wafer, Cu=400 nm Ta=50nm SiO2=300nm, Si(100) P-type B-doped 4"x0.525mm, 1sp High Purity Chemical A-Z The slot die heads are

$228.85

Quantity
Description

The slot die heads are available in 50mm or 100mm widths with optional thickness shims

5 um (+/- 20%)

mso-border-insideh:

Length: 170m

Polishing: one side polished

Cu Film on Ta/SiO2/ 4"Silicon Wafer, Cu=400 nm Ta=50nm SiO2=300nm, Si(100) P-type B-doped 4"x0.525mm, 1sp High Purity Chemical A-Z The slot die heads areSpecifications: Cu <111> coated Si Wafer (4 inch size) Thickness of highly oriented polycrystalline Cu <111> film: 400 nm Thickness of Ta diffusion barrier: 50 nm 4 inch dia x0. 525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk P type, B doped, <100> orientation, SSP Resistivities: 1 20 ohm cm Surface Roughness: as grown , N A Package: One 1000 class clean room with 100 class plastic bag

Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
  • If time is of the essence, please consider selecting expedited delivery for faster service.

View More

  • Product more
  • Collection:

You may also like

recommand products

50$ Store Credit
Your message