Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 This is the second edition

This is the second edition of BS EN ISO 17672:2016 and replaces the 2010 standard

a) electrical test and measurement equipment which by electrical means tests

By complying with BS EN ISO 19011:2002

and requirements on joints

BS EN 1998-6 establishes requirements

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 This is the second editionWhat is this standard about? This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die to die alignment is used in the die stacking.